This flexible system is designed for low stress on sensitive components during and after cure. High thermal conductivity, ionically clean, flexible, low stress solution for large die Epic 0154 features good electrical properties, minimal settling characteristics and good heat transfer in a single component epoxy. Epic 0154 has excellent shelf-life stability for a one-component heat cure epoxy resin. Appli-Thane® 7300 is also used in manufacturing and automated dispensing applications due to its 4-hour pot life. The cost difference between the two systems was 20%. The excellent electrical properties make it a candidate material for both high and low voltage electrical assemblies. Currently, there is a strong trend toward the electrification of vehicles in the transportation industry, including automobiles, buses, trains, off-road vehicles, watercraft, and aircraft. Even the moderately conductive silicones, CoolTherm SC-305 and SC-309 encapsulants at 0.7 and 1.0 W/m∙K, respectively, provided significant improvements. The average temperature rise with Thermoset SC-400 encapsulant was about 55°C, and the average rise for the most thermally conductive materials, CoolTherm SC-320 and SC-324 encapsulants, was less than 10°C. Error bars are plus and minus one standard deviation of the data, which includes part-to-part variation and repeatability. Thermally Conductive, two parts, low viscosity potting compound that cures at room temperature to a soft pliable rubber. 45,000 cps. With a Shore A hardness of 70, the soft urethane material provides resistance to vibration, as well as low shrinkage, for minimal stress on components during cure. Release Date: 10/10/2019. Before potting, each inductor was fitted with a thermocouple to measure its temperature during the test. Whether you need a quote or you have questions about material availability, we can help. This property mix is achieved thanks to minimal thixotropic or pseudoplastic behavior, reducing the risk of air bubbles. Each adhesive listed can be modified to suit your application: Ideal for aerospace applications as it meets NASA’s outgassing requirements. regulations. Master Bond Supreme 121AO is a NASA low outgassing approved epoxy suitable for bonding, sealing and potting applications. Our epoxy potting compound portfolio includes many functional specialties including flame retardancy, thermal conductivity, optical clarity, and dimensional stability. The other factor not … Key features: Low viscosity urethane, self-leveling, D.O.T. With the non-conductive silicone, Thermoset SC-400 encapsulant, nearly two hours was required to reach steady state, whereas a stable temperature was achieved in less than 20 minutes for CoolTherm SC-320 and SC-324 encapsulants. Provides best-in-class thermal conductivity for applications requiring aggressive heat dissipation of components. For the thermal tests, each inductor was connected to a Manzanita Micro PFC40X-188 charger passing 9.3 kW and 40 A at 240V input with 0.98 power factor. Parker Chomerics THERM-A-FORM™ thermally conductive silicone elastomer products are dispensable form in- place compounds designed for heat transfer without excessive compressive force in electronics cooling applications. It is better than air so it does help, but then use the less expensive normal potting compounds. Available in pre-mixed and degassed frozen syringes or 2-part kits. 60 A/Gray. Long ranges and/or high horsepower require high power density from their electrical components such as batteries, motors and generators, and the power electronics needed for operation. Thermally speaking, the potting material acts like a heat insulator. Thermally Conductive PU Potting Compound -- 20-2366FR from Epoxies Etc... 20-2366 FR is a new thermally conductive polyurethane potting compound. The material passes NASA’s outgassing requirements and provides strain relief for many bonding applications where high thermal conductivity isn’t required. Plus a little humor too. Designed to achieve primerless adhesion to many substrates, including metals, plastics, and ceramics. It is important to note that the variation becomes much smaller as the thermal conductivity increases due to the more effective thermal connection to the aluminum cooling plate. 832TC Thermally Conductive Epoxy, Potting and Encapsulating Compound Container Format Change PCN Tracking Number: 001-1601-4 Notification Date: 22 January 2016 PCN Effective Date: 22 January 2016 Author: Michel Hachey, Ph.D. Summary: The tall, narrow-mouth, 1 L containers used for the 832TC epoxy made the product difficult to stir and de-air, which lead to … It uses high-purity aluminum oxide to provide excellent thermal conductivity at reasonable costs. Typical … Each of the 15 inductors were tested at least one time, and several of the inductors were tested multiple times to determine repeatability. Formulated to draw heat away from sensitive electronic components, these potting compounds have higher thermal conductivity than standard potting compounds. Technical data sheets for all commercial products can be found using the search bar at the top of this page or here. The equilibration time was chosen at the point when the temperature reached steady state (no further temperature increase took place), and the reported temperature rise was calculated as the final temperature of the inductor minus the initial temperature. Our rigorously tested adhesive products solve the challenges associated with advanced potting and encapsulation applications including: All Appli-Tec potting compounds come pre-tested, pre-mixed and pre-packaged in sizes ranging from 1cc – 30cc for hand dispense syringes to 3cc – 55cc for pneumatic dispensing. 5308 has a 1.26 W/mK thermal conductivity. The data show that both the inductor temperature rise and the equilibration time are independent of the coolant temperature, as the data at 25°C and 50°C are nearly superimposable and within the test variation. The aluminum cooling plate was connected to a temperature-controlled liquid bath; each inductor was tested at coolant temperature set points of 25°C, and the typical automotive coolant temperature of 50°C. 8:00am–5:00pm EST Figure 1 shows thermal conductivity versus viscosity of LORD silicone materials as compared to various competitor products. All of the materials are electrically insulating with high dielectric strength and excellent high-temperature stability. Two part dual cure general potting … Many of the commercially available high performance products are not viable options due to the cost that they add to the electronic devices. Both of these benefits bring about improvements in efficiency and component lifetime, thereby enabling high-performance power electronics. By nature, epoxy and polyurethanes are electrically insulative; the degree varies based on the specific formulation. Key features: Wicks easily into tight spaces, 8-hour work life. The material is ideal for applications requiring a self-leveling room temperature cure and better than average thermal conductivity. This rapid temperature recovery means that heat is dissipated quickly and components will spend less time at elevated temperatures, thus increasing the lifetime of the components. UV 9052 A/B. A pre-mixed, degassed, tested and frozen epoxy, 5316 is also available in 2-part room temperature stable kits. Duralco ® conductive Adhesives … One key challenge in developing these types of components is to manage the heat generated by smaller, high-power devices like on-board battery chargers, power inverters and converters, and electric machines. Currently, there is a strong trend toward the electrification of vehicles in the transportation industry, including automobiles, buses, trains, off-road vehicles, watercraft, and aircraft. UR5097 thermally conductive polyurethane potting compound exhibits excellent thermal conductivity making it ideal for applications where heat dissipation is required. Dramatic reductions in both temperature rise and equilibration time are observed for inductors potted with thermally conductive materials (see Figure 6). 5 hrs/ 3 hrs @ 65°C. Power at the inductor was 30W. Epic 0154 is a low-temperature heat cure, thermally conductive epoxy potting compound for electrical components. The cured resin is resistant to a wide or cycling temperature range making it an ideal choice for applications where thermal shock is a potential risk to the electronics, while it is also flame retardant to … 3200°F Electrically Resistant Coating: Durapot™ 820 is a 3200°F, one component paint and … LORD Corporation has been supplying thermally conductive, electrically insulating potting materials to the power electronics industry for over a decade, and recently, we have been testing the effectiveness of using potting compounds with high thermal conductivity to dissipate heat in high-power applications. Key features: High Tg, low shrinkage, flowable, and 3-hour pot life. A second thermocouple was attached to the exterior of the cooling plate to monitor temperature changes during the test; however, the temperature rise of the cooling plate was less than 2°C even in the most extreme cases and, accordingly, will not be considered further. The inductors used in this study were made from Micrometals T400-61D high-temperature, magneticpowder toroid cores wrapped with 62 turns of 10-gauge insulated copper wire, which yield about 500 μH inductance at load. Similarly, the equilibration time was also dramatically reduced with the higher thermally conductive materials (see Figure 7). Low viscosity thermally conductive two part silicone. The normal potting compound was only 110°C but the potting compound that was five times more thermally conductive was only 113°C. The five different materials were used to pot three inductors with each material, resulting in a total of 15 potted inductors. Thermally conductive adhesives serve an additional purpose as well. RoHS compliant. Convenient mix ratios; UL94 V-0 and UL 746A grades available; Thermally conductive options available; Low exotherm; Excellent dielectric properties; Wide service temperature range ; … A one-part, black, electrically isolating epoxy compound specifically designed for potting and sealing electronic components. Volume resistivity for the materials listed is greater than 1×1014. Long work and/or pot life for robotic applications. Thermally conductive epoxy encapsulating and potting compound. Thermal conductivity of a typical unfilled epoxy system has a very low value of 0.14 W/(m•K). Applications for 0126 … A black, electrically isolating, thermally conductive epoxy designed specifically for staking and encapsulating electronics on circuit boards as well as potting and encapsulating power supplies, transformers, and coils. Using LORD thermal management materials that provide the unique combination of high thermal conductivity and low viscosity, we have demonstrated substantial reductions in both maximum temperature rise and the time to reach a stable temperature. 100:100 . 505-06 FR. For more than 90 years, LORD has worked in collaboration with our customers to provide innovative oil and gas, aerospace, defense, automotive and industrial solutions. non-hazardous, transparent, and flexible. Key features: Resistant to high temperatures, adheres to dissimilar materials, and self-leveling. As a result, heat is dissipated within the enclosure and rapidly conducted to the heat sink, which has enabled substantial size and weight reductions of the finished component. An optically clear, low viscosity, electrically isolating epoxy compound, 5051 bonds well to most substrates such as metals, glass, ceramics, and most plastics. We are a For example, we have demonstrated substantial temperature reductions and improved power output using LORD CoolTherm® SC-320 Thermally Conductive Silicone Encapsulant to pot the end windings of electric motors. Figure 5 shows a representative plot for an inductor potted with Thermoset SC-400 encapsulant with the parameters indicated. These versatile liquid reactive materials can be dispensed and then cured into complex geometries for cooling of multi-height components on … Inductors were potted in custommade aluminum cooling plates fitted with liquid inlet and outlet ports for connection to an external circulating fluid bath. Cotronics ® Duralco ® Thermally Conductive Adhesives and potting compounds provide the heat dissipation required for many High Temperature Electronic and Industrial applications. • Thermally conductive silicone compounds • Flexible heat spreaders • Thermal management for BGAs LEADER IN THERMAL MANAGEMENT: DESIGN, INNOVATION AND MATERIALS TECHNICAL BULLETIN 62 CHO-THERM® 1641 & 1642 Thermally Conductive Silicone Compounds CHO-THERM® 1641 CHO-THERM 1641 compound is a one-component thermally conductive … A key differentiating property of LORD thermally conductive silicone materials is their low viscosity compared to competitor materials with similar thermal conductivity. Thanks to new thermally conductive silicone based compound call CoolMag™ to provide an excellent mechanically and thermally well connected critical components to heat-sink or cool plate. 100:100. The material meets NASA’s outgassing requirements, is resistant to solvents and chemicals, and is considered non-hazardous per D.O.T. SilCool TIA216G is a 2-component, thermally conductive potting material used primarily on complex thermal interface designs. Featuring a high glass transition temperature of 200-210°C, it resists temperatures up to 550°F. Technical Documents × SDS SilCool* TIA216G Thermally Conductive Silicone Rubber Product Literature × Download All. Key features: Self-leveling, injectable; cures to a semi-flexible material with relatively low modulus and very low Tg. 45 min/ 24 hrs @ 25°C. All thermally conductive potting compound wholesalers & thermally conductive potting compound manufacturers come from members. Despite their high filler content, they exhibit good flow properties with low viscosity. Key features: Electrically isolating, 1.48 W/mK thermal conductivity, low shrinkage, and flowable. Potted components de-air easily. … The cured material’s ability to not crack or harm bonded rigid components during thermal cycling is a major plus. As a result, heat is dissipated within the enclosure and rapidly conducted to the heat sink, Also, most potting compounds create too much heat when curing in large mass sizes. Thermally conductive potting compounds are proving to be an ideal method for rapidly and effectively conducting heat away from power components to the heat sink. Choose from our selection of thermally conductive epoxies, including heat-transfer potting compounds, epoxy potting compounds, and more. 5108 is a pre-mixed, degassed, tested and frozen epoxy. This material is ideal for applications requiring a thermally conductive epoxy with resistance to solvents and chemicals. TIA222G Thermally Conductive … Pre-mixed, degassed, tested, and frozen polyurethane adhesive. Electrolube have a range of specialist epoxy, polyurethane and silicone resins which have been … WACKER’s thermally conductive silicone encapsulants and potting compounds are optimized for bubble-free encapsulation. LORD CoolTherm SC-305, SC-309, SC-320, and SC-324 Thermally Conductive Silicone Encapsulant are filled silicone potting materials with progressively higher thermal conductivities of 0.7, 1.0, 3.0, and 4.0 W/m∙K, respectively. 5336 is supplied in frozen syringes. Power was then applied, and the temperature was monitored until the inductor temperature stabilized. N/A. Use them to encase electronic assemblies for protection from dust, chemicals, moisture, mechanical shock, and vibration. It is a low viscosity alternative to ER2220 system which is ideal for potting and encapsulating electronics or components with limited spacing and where thermal dissipation is … (See Figure 3.) This material is also environmentally friendly and considered non‐hazardous per D.O.T. Long ranges and/or high horsepower require high power density from their electrical components such as batteries, motors and generators, and the power electronics needed for operation. One set of potted inductors is shown in Figure 2. A black, electrically isolating, thermally conductive epoxy designed specifically for staking and encapsulating electronics on circuit boards as well as potting and encapsulating power supplies, transformers, and coils. 50-2366FR is a thermally conductive polyurethane potting compound. Thermally Conductive Epoxy Encapsulating & Potting Compound 832TC Technical Data Sheet Description The 832TC Thermally Conductive Epoxy, Encapsulating and Potting Compound is an electric grade epoxy. Electrolube have a range of specialist epoxy, polyurethane and silicone resins which have been … SilCool* TIA216G Thermally Conductive Silicone Rubber. WO2002040589A1 - Thermally conductive casting compound - Google Patents Thermally conductive casting compound Download PDF Info Publication number WO2002040589A1. Download Technical Data View Product Literature. 832TC potting and encapsulating compound is a thermally conductive, black, two-part epoxy that offers extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. 505-07 A/B. This material is ideal for applications requiring a thermally conductive epoxy with resistance to solvents and chemicals. A pre-mixed, degassed, tested and frozen epoxy. M-F: The average temperature rise and equilibration time data are summarized in Figures 6 and 7. Appli-Tec develops and manufactures precision mixed adhesives for engineers who need consistent, repeatable results - every time. 100 Percent solids. Ability to withstand high temperatures, weather, lubricants, water, etc. Featuring a 3-hour pot life, 5308 has good flowability, making it ideal for applications requiring a self-leveling material. This key property can be increased by adding metallic or ceramic fillers to the adhesive formulation. Salem, NH 03079. The potting compound fills the component enclosure entirely, leaving no air gaps. The trend is towards smaller, lighter, and less expensive components that will save space and reduce costs while boosting power efficiency. In stock and ready to ship. Thermally conductive potting compounds are proving to be an ideal method for rapidly and effectively conducting heat away from power components to the heat sink. With more than 3,100 employees in 26 countries, 19 manufacturing facilities and 10 R&D centers worldwide, we're there for our customers. Will cure in deep sections. Equal mix blush free potting compound pending UL approval. Rigid and wear resistant, epoxies are the strongest of the potting compounds. Engineers, constructing owners, and constructors can advantage Epoxy potting compound working with this material applied in precast sandwiched wall panels. Pigmented black for excellent thermal absorption and emission. Under different test conditions that would generate a temperature rise much greater than 55°C, it is likely that the improvement would be even more pronounced. LORD ThermosetTM SC-400 Silicone Encapsulant is a clear, soft gel with low thermal conductivity (0.1 W/m∙K) used for potting sensitive electronics where high dielectric strength and very low mechanical stress are desired. 5336 is supplied in frozen syringes. General one component potting compound pending UL. The cooling plate and inductor temperatures were allowed to stabilize with no power. Appli-Thane 7125 has low thermal conductivity. 85 D/Black. They can be either electrically conductive or electrically insulative, as illustrated in the diagram below… With strong structural integrity, this thermally conductive epoxy compound offers long-lasting, reliable performance. 5108 is a self-leveling material that exhibits low shrinkage once cured and can withstand high temperatures and high humidity or wet environments. Because the surfaces of both aren’t absolutely smooth at the microscopic level, tiny gaps exist – thus reducing the effectiveness of the contact area. The potting compound fills the component enclosure entirely, leaving no air gaps. 3000°F Highly Thermally Conductive, Potting Compound: Durapot™ 810 Alumina based, thermally conductive potting compound and adhesive developed to provide excellent electrical resistance at high temperature and improved thermal conductivity for high power applications. Pre-mixed, degassed, tested and frozen polyurethane adhesive. This product is designed for applications where thermal management is a concern. The complete set-up is shown in Figure 4. / 1 877 275-5673, Semiconductor Packaging and Circuit Assembly, How Proper Application of Thermally Conductive Materials Will Improve Motor Power Density. Due to its high thermal conductivity, it protects circuits, by reducing the risk of heat … thermally conductive potting compound wholesale, buy thermally conductive potting compound from 40 thermally conductive potting compound suppliers from China. The lower viscosity allows LORD materials to flow and fill voids more readily while providing excellent thermal conductivity. Thermally conductive potting compounds are resins designed to encapsulate components or ‘pot’ the entire PCB unit, dissipating heat away from the electronic components and in the process offering additional protection from environmental elements such as water or chemicals. Potting Compounds Conformal Coatings & Conductive Adhesives Electronics - Potting Compounds Conformal Coatings & Conductive adhesives ECT Adhesives, in conjunction with our global manufacturing partners, offer a complete range of Potting Compounds, Conformal Caotings, Electrically and Thermally Conductive adhesives to meet all your requirements in the … The location of the thermocouple corresponds to the hottest location in the inductor as judged qualitatively from a thermal camera image of an unpotted inductor under load. Manufactures precision mixed adhesives for engineers who need consistent, repeatable results - every time improvements in and. Heat transfer in a single component epoxy spaces, 8-hour work life best-in-class! 2-Part kits as it meets NASA ’ s outgassing requirements, is low viscosity urethane product, 7125! The heat sink are plus and minus one standard deviation of the commercially available high performance products not... 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